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Investigation of UBM system for electroplated Sn/37Pb and Sn3.5Ag solder
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2001
Conference Paper
Titel
Investigation of UBM system for electroplated Sn/37Pb and Sn3.5Ag solder
Author(s)
Jang, W.
Ehrmann, J.
Gloor, O.
Reichl, H.
Hauptwerk
ECTC 2001. Proceedings of the 51st Electronic Components & Technology Conference
Konferenz
Electronic Components and Technology Conference (ECTC) 2001
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM