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Parametrized models for a RF chip-to-substrate interconnect

 
: Doerr, I.; Hwang, L.-T.; Sommer, G.; Opermann, H.; Li, L.; Petras, M.; Korf, S.; Sahli, F.; Myers, T.; Miller, M.; John, W.

Electronic Components, Assemblies, and Materials Association; Components, Packaging and Manufacturing Technology Society -CPMT-:
ECTC 2001. Proceedings of the 51st Electronic Components & Technology Conference
Orlando/FL: Piscataway, 2001
ISBN: 0-7803-7040-6
Electronic Components and Technology Conference (ECTC) <51, 2001,Orlando/Fla.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/B-82315.html