Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages
| Institute of Electrical and Electronics Engineers -IEEE-; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin:
Polytronic 2001, International Conference on Polymers and Adhesives in Microelectronics and Photonics. Proceedings
New York, NY: IEEE, 2001
ISBN: 0-7803-7220-4
S.155-158 |
| International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) <1, 2001, Potsdam> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer IZM () |