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Plasma deposited CF polymer films as ultra low k intermetal dielectric, film properties and application
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2001
Conference Paper
Titel
Plasma deposited CF polymer films as ultra low k intermetal dielectric, film properties and application
Author(s)
Uhlig, M.
Bertz, A.
Werner, T.
Gessner, T.
Hauptwerk
Polytronic 2001, International Conference on Polymers and Adhesives in Microelectronics and Photonics. Proceedings
Konferenz
International Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic) 2001
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM