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Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systems
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2002
Journal Article
Titel
Application of combined thermal and electrical simulation for optimization of deep submicron interconnection systems
Author(s)
Streiter, R.
Wolf, H.
Zhu, Z.
Xiao, X.
Gessner, T.
Zeitschrift
Microelectronic engineering
DOI
10.1016/S0167-9317(01)00579-2
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM