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S/4 method for the analysis of residual stress induced failure in thin films
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2001
Journal Article
Titel
S/4 method for the analysis of residual stress induced failure in thin films
Author(s)
Uhlmann, E.
Klein, K.
Zeitschrift
CIRP Annals. Manufacturing Technology
DOI
10.1016/S0007-8506(07)62150-7
Language
English
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Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK