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Electro-thermal circuit simulation using simulator coupling

: Wünsche, S.; Clauß, C.; Schwarz, P.; Winkler, F.


IEEE transactions on very large scale integration (VLSI) systems 5 (1997), Nr.3, S.277-282
ISSN: 1063-8210
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()
circuit simulation; finite element simulation; simulator coupling; thermal; modeling

The paper presents a methodology for simulating the static and dynamic performance of integrated circuits in the presence of electro-thermal interactions on the integrated circuit die. The technique is based on the coupling of a finite element method (FEM) program with a circuit simulator. In difference to other known simulator couplings a time step algorithm is used. Its implementation into simulation tools is described. The thermal modeling of the die/package structure and the extended modeling of the electronic circuit is discussed. Simulation results which indicate the capabilities of the methodology for electro-thermal simulation are compared to experimental results.