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Surface modification due to technological treatment evaluated by SPM and XPS techniques

: Krause, F.; Halser, K.; Töpper, M.; Scherpinski, K.

Michel, B.; Winkler, T.; Werner, M.; Fecht, H.-J. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; Deutscher Verband für Materialforschung und -prüfung e.V. -DVM-, Berlin:
MicroMat 2000. Proceedings 3rd International Conference and Exhibition Micro Materials : April 17 - 19, 2000, Berlin, Germany
Dresden: ddp Goldenbogen, 2000
ISBN: 3-932434-15-3
Micro Materials (Micro Mat) <3, 2000, Berlin>
Fraunhofer IZM ()

Surface modification of Photo BCB due to dry and wet etching techniques is a well known procedure to increase surface quality and layer adhesion. Reactive Ion Etching is one of the suitable methods for surface topography modification and via cleaning in thinfilm technology. To achieve best results in surface quality like roughness, adhesion, planarity and purity Reactive Ion Etching parameters have to be optimized.