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A new approach for system integrated packaging
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2000
Conference Paper
Titel
A new approach for system integrated packaging
Author(s)
Aschenbrenner, R.
Jung, E.
Ostmann, A.
Landesberger, C.
Reichl, H.
Hauptwerk
3rd Electronics Packaging Technology Conference (EPTC 2000). Proceedings
Konferenz
Electronics Packaging Technology Conference (EPTC) 2000
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM