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A simple model for the mode I popcorn effect for IC packages
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2000
Conference Paper
Titel
A simple model for the mode I popcorn effect for IC packages
Author(s)
Alpern, P.
Lee, K.C.
Dudek, R.
Tilgner, R.
Hauptwerk
Reliability of electron devices, failure physics and analysis
Konferenz
European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) 2000
DOI
10.1016/S0026-2714(00)00116-5
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM