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Investigation of bonding behaviour of different borosilicate glasses

 
: Wiemer, M.; Hiller, K.; Gessner, T.; Kloss, T.; Schneider, K.; Leipold-Haas, U.; Bagdahn, J.; Petzold, M.

Michel, B.; Winkler, T.; Werner, M.; Fecht, H.-J. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; Deutscher Verband für Materialforschung und -prüfung e.V. -DVM-, Berlin:
MicroMat 2000. Proceedings 3rd International Conference and Exhibition Micro Materials : April 17 - 19, 2000, Berlin, Germany
Dresden: ddp Goldenbogen, 2000
ISBN: 3-932434-15-3
S.1280-1282
Micro Materials (Micro Mat) <3, 2000, Berlin>
Englisch
Konferenzbeitrag
Fraunhofer IWM ()
Fraunhofer IZM ()
borosilicate glass; borofloat; anodic bonding; wafer bonding; micro chevron test

Abstract
New investigations were carried out in order to characterise the anodic bonding behaviour of borosilicate glass Borofloat 33 in comparison with different suppliers of borosilicate glass wafers. Firstly the original surfaces were characterised. This was followed by anodic bonding experiments of the glass wafers with unpatterned and patterned silicon wafers. The compounds with unpatterned substrates were evaluated and compared with respect to the parameters bonding temperature, bonding time and current flow. Furthermore, test patterns (Chevron notches) for evaluation of bond strength were prepared, anodically bonded to the glass wafers and then loaded using the Micro Chevron Test up to the failure of the bond.

: http://publica.fraunhofer.de/dokumente/B-68224.html