Abstract
New investigations were carried out in order to characterise the anodic bonding behaviour of borosilicate glass Borofloat 33 in comparison with different suppliers of borosilicate glass wafers. Firstly the original surfaces were characterised. This was followed by anodic bonding experiments of the glass wafers with unpatterned and patterned silicon wafers. The compounds with unpatterned substrates were evaluated and compared with respect to the parameters bonding temperature, bonding time and current flow. Furthermore, test patterns (Chevron notches) for evaluation of bond strength were prepared, anodically bonded to the glass wafers and then loaded using the Micro Chevron Test up to the failure of the bond.