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Lifetime investigations of directly wafer-bonded samples under static and cyclic loading

: Bagdahn, J.; Petzold, M.; Sommer, E.

Michel, B.; Winkler, T.; Werner, M.; Fecht, H.-J. ; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; Deutscher Verband für Materialforschung und -prüfung e.V. -DVM-, Berlin:
MicroMat 2000. Proceedings 3rd International Conference and Exhibition Micro Materials : April 17 - 19, 2000, Berlin, Germany
Dresden: ddp Goldenbogen, 2000
ISBN: 3-932434-15-3
Micro Materials (Micro Mat) <3, 2000, Berlin>
Fraunhofer IWM ()
silicon; wafer bonding; static loading; cyclic loading; lifetime

Strength and fatigue tests were performed to investigate the reliability properties of Si wafer-bonded samples exposed to static or cyclic mechanical loading. A distinct strength decrease with increasing loading duration or load cycle number, respectively was found limiting the lifetime of mechanically stressed wafer bonded components. As a consequence, loaded wafer-bonded sensors and actuators may suddenly fail during application. Appropriate fracture mechanical approaches can be applied to predict the lifetime behavior for a given loading situation and, therefore, to provide a high reliability of micromechanical devices.