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Chip Formation and Sub-surface Damage in Ductile Mode Grinding of Semiconductors
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1998
Conference Paper
Titel
Chip Formation and Sub-surface Damage in Ductile Mode Grinding of Semiconductors
Author(s)
Uhlmann, E.
Engel, H.
Paesler, C.
Hauptwerk
American Society for Precision Engineering. 13th Annual Meeting 1998. Proceedings
Konferenz
American Society for Precision Engineering (Annual Meeting) 1998
Language
English
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Fraunhofer-Institut für Produktionsanlagen und Konstruktionstechnik IPK