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Flip chip solder joint reliability
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1999
Conference Paper
Titel
Flip chip solder joint reliability
Author(s)
Schubert, A.
Dudek, R.
Vogel, D.
Becker, K.-F.
Kloeser, J.
Michel, B.
Reichl, H.
Hauptwerk
APACK '99. Symposium on Advances in Packaging. Proceedings
Konferenz
Symposium on Advances in Packaging (APACK) 1999
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM