Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Morphology and electromigration lifetime of copper lines with different barriers
| Cheung, R. ; Univ. of California, Continuing Education in Engineering:
Advanced metallization and interconnect systems for ULSI applications in 1999. Proceedings of the conference
Warrendale, Pa.: MRS, 1998
ISBN: 1-558-99412-2
S.427-435 |
| Conference on Advanced Metallization and Interconnect Systems for ULSI Applications <14, 1997, San Diego/Calif.> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer IZM () |