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Morphology and electromigration lifetime of copper lines with different barriers

 
: Schulz, S.E.; Baumann, J.; Weidner, J.-O.; Hasse, W.; Koerner, H.; Gessner, T.

Cheung, R. ; Univ. of California, Continuing Education in Engineering:
Advanced metallization and interconnect systems for ULSI applications in 1999. Proceedings of the conference
Warrendale, Pa.: MRS, 1998
ISBN: 1-558-99412-2
S.427-435
Conference on Advanced Metallization and Interconnect Systems for ULSI Applications <14, 1997, San Diego/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/B-63047.html