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Materials mechanics and thermo-mechanical reliability of flip chip area array packages
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1999
Conference Paper
Titel
Materials mechanics and thermo-mechanical reliability of flip chip area array packages
Author(s)
Schubert, A.
Dudek, R.
Michel, B.
Hauptwerk
Advances in electronic packaging 1999. Proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference. Vol.1
Konferenz
Pacific Rim ASME International Intersociety Electronic and Photonic Packaging Conference (Interpack) 1999
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM