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Integration of NiCr resistors in a multilayer Cu/BCB wiring system



Wong, C.P. ; International Microelectronics and Packaging Society -IMAPS-; IEEE Components, Packaging, and Manufacturing Technology Society:
International Symposium on Advanced Packaging Materials 1999: Processes, Properties and Interfaces. Proceedings
Reston, Va.: IMAPS, 1999
ISBN: 0-930815-56-4
ISBN: 0-7803-5508-3
International Symposium on Advanced Packaging Materials <5, 1999, Braselton/Ga.>
Fraunhofer IZM ()

The integration of passive components into the wiring substrate is essential for the further miniaturization and cost reduction of electronic systems. CSP and high density multilayer boards are becoming standard in the electronic industry. But most often a lot of space on the board has to be used for passive components. The integration of passives into the board will minimize the whole system and will also reduce the cast of assembled. The focus of this paper is to give an insight into the process for the integration of NiCr resistors in an MCM-D substrate. Two approaches will be presented: 1. NiCr resistors directly on the substrate with the multilayer Cu/Photo-BCB on top. 2. NiCr resistors between the Cu/Photo-BCB. A test layout was designed to achieved different value of resistance. Two different technologies were used to structure the resistors. The reproducibility of the technology will be given. A strong effect of the Photo-BCB process to the electrical resistance of the NiCr layers was found. Thermal aging and first reliability tests were carried out using these test-structures.