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Solder joint with improved high temperature characteristics
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1999
Conference Paper
Titel
Solder joint with improved high temperature characteristics
Author(s)
Nowottnick, M.
Scheel, W.
Wittke, K.
Pape, U.
Schulz, J.-U.
Hauptwerk
22nd International Spring Seminar on Electronics Technology 1999. Conference proceedings ISSE '99 - technology drivers in electronics
Konferenz
International Spring Seminar on Electronics Technology (ISSE) 1999
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM