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Reliability investigations of flip-chip solder bumps on palladium
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1999
Conference Paper
Titel
Reliability investigations of flip-chip solder bumps on palladium
Author(s)
Kallmayer, C.
Oppermann, H.
Kalicki, R.
Klein, M.
Anhöck, S.
Ostmann, A.
Aschenbrenner, R.
Reichl, H.
Hauptwerk
49th Electronic Components & Technology Conference 1999. Proceedings
Konferenz
Electronic Components and Technology Conference (ECTC) 1999
DOI
10.1109/ECTC.1999.776161
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM