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Fabrication of high frequency microscanners by using low temperature silicon wafer bonding
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1999
Conference Paper
Titel
Fabrication of high frequency microscanners by using low temperature silicon wafer bonding
Author(s)
Hiller, K.
Wiemer, M.
Hahn, R.
Kaufmann, C.
Kurth, S.
Kehr, K.
Gessner, T.
Dötzel, W.
Milekhin, A.
Friedrich, M.
Zahn, D.
Hauptwerk
Transducers '99, 10th International Conference on Solid-State Sensors and Actuators. Digest of technical papers
Konferenz
International Conference on Solid-State Sensors and Actuators 1999
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM