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Quality and mechanical reliability assessment of wafer-bonded micromechanical components
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1999
Journal Article
Titel
Quality and mechanical reliability assessment of wafer-bonded micromechanical components
Author(s)
Petzold, M.
Bagdahn, J.
Katzer, D.
Zeitschrift
Microelectronics reliability
DOI
10.1016/S0026-2714(99)00156-0
Language
English
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Fraunhofer-Institut für Werkstoffmechanik IWM