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Low profile and flexible electronic assemblies using ultra-thin silicon - the european Flex-Si projekt
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2003
Book Article
Titel
Low profile and flexible electronic assemblies using ultra-thin silicon - the european Flex-Si projekt
Author(s)
Harder, T.
Hauptwerk
Foldable flex and thinned silicon multichip packaging technology
Language
English
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Fraunhofer-Institut für Siliziumtechnologie ISIT