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InterChip via technology by using copper for vertical system integration

 
: Ramm, P.; Bonfert, D.; Ecke, R.; Iberl, F.; Klumpp, A.; Riedel, S.; Schulz, S.E.; Wieland, R.; Zacher, M.; Gessner, T.

McKerrow, A.J. ; Univ. of California, Continuing Education in Engineering:
Advanced Metallization Conference, AMC 2001 : Proceedings of the conference held October 8 - 11, 2001, in Montreal, Canada. A parallel session was held October 29 - 31, 2001 in Tokyo, Japan
Warrendale, Pa.: Materials Research Society, 2002
ISBN: 1-558-99670-2
S.159-168
Advanced Metallization Conference (AMC) <2001, Montreal>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/B-301155.html