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Patent
Title

Diamantkoerper

Other Title
Diamond body for thermal contacting heat source(s) for efficient heat dissipation of semiconductor power modules - contains longitudinal recesses angularly extending w.r.t. mechanical stresses thermally induced by heat source(s).
Abstract
The diamond body (12) contains at least one longitudinal recess (13,15), extending at an angle to mechanical stresses induced by coupling to each heat source (30). Pref. a number of recesses extend obliquely to a heat flow direction induced by at least one heat source and/or heat sink. The number of the recesses may be so aligned w.r.t. each heat source and/or heat sink that the alignment angles to the mechanical stresses are larger than those to the heat flow directions. Typically the recesses are aligned orthogonally to the mechanical stresses. ADVANTAGE - Reduced danger of connection loosening or diamond body destruction by thermally induced mechanical stresses.
Inventor(s)
Koidl, P.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Wild, C.
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
Wörner, E.
Link to Espacenet
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=19701680A
Patent Number
1997-19701680
Publication Date
2001
Language
German
Fraunhofer-Institut für Angewandte Festkörperphysik IAF  
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