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Diamond body for thermal contacting heat source(s) for efficient heat dissipation of semiconductor power modules - contains longitudinal recesses angularly extending w.r.t. mechanical stresses thermally induced by heat source(s).
: Koidl, P.; Wild, C.; Wörner, E.

Frontpage ()

DE 1997-19701680 A: 19970118
DE 1997-19701680 A: 19970118
DE 19701680 C2: 20010802
Patent, Electronic Publication
Fraunhofer IAF ()

The diamond body (12) contains at least one longitudinal recess (13,15), extending at an angle to mechanical stresses induced by coupling to each heat source (30). Pref. a number of recesses extend obliquely to a heat flow direction induced by at least one heat source and/or heat sink. The number of the recesses may be so aligned w.r.t. each heat source and/or heat sink that the alignment angles to the mechanical stresses are larger than those to the heat flow directions. Typically the recesses are aligned orthogonally to the mechanical stresses. ADVANTAGE - Reduced danger of connection loosening or diamond body destruction by thermally induced mechanical stresses.