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Developments in wire bonding and alternative interconnection methods for applications in microsystem and multi chip technologies
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1993
Conference Paper
Title
Developments in wire bonding and alternative interconnection methods for applications in microsystem and multi chip technologies
Author(s)
Lang, K.-D.
Zakel, E.
Reichl, H.
Mainwork
Transactions on the precision and electronic technology. Vol.1: Proceedings of the 1st International Seminar in Precision and Electronic Technology 1993
Conference
International Seminar in Precision and Electronic Technology (INSEL) 1993
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
