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The Development of a Top-Bottom-BGA (TB-BGA)

 
: Leutenbauer, R.; Grosser, V.; Michel, B.; Reichl, H.

:

International Microelectronics and Packaging Society -IMAPS-:
International Conference on Multichip Modules and High Density Packaging 1998. Proceedings
Piscataway, NJ: IEEE, 1998
ISBN: 0-7803-4850-8
ISBN: 0-7803-4851-6
pp.247-252
International Conference on Multichip Modules and High Density Packaging <1998, Denver/Colo.>
English
Conference Paper
Fraunhofer IZM ()
Bauelement; BGA; CSP; gedruckte Schaltung; Keramik; Schnittstelle; TB-BGA

Abstract
A "Top Bottom Ball Grid Array" (TB-GBA) is described, that takes advantage of existing BGA and CSP techniques, to create a new package for SCMs, MCMs, sensors and actuators. By using a pin-compatible BGA configuration at the bottom and the top of the carrier, a 3D stack assembly of several TB-BGAs is possible. As demonstrators ceramic TB-BGAs are actually developed as single chip modules (SCMs) and multichip modules (MCMs). They will be mounted as intelligent sensors bus interfaces in convetional sensor casings. A full operating 16-bit-processor-unit including microcontroller, SRAM, EEPROM, CAN bus interface, oscillator and SMD components will require a volume of only 1.2 cm3.

: http://publica.fraunhofer.de/documents/PX-9580.html