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Deformation analysis on flip chip solder interconnects by MicroDAC
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1997
Conference Paper
Titel
Deformation analysis on flip chip solder interconnects by MicroDAC
Author(s)
Vogel, D.
Auersperg, J.
Schubert, A.
Michel, B.
Reichl, H.
Hauptwerk
Design and reliability of solders and solder interconnections 1997. Proceedings of a symposium held during the TMS Annual Meeting
Konferenz
Solder Joint Symposium 1997
TMS Annual Meeting 1997
Language
English
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Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM