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Conventional Micromachining for Microassembly Applications

 
: Eberhardt, R; Gebhardt, A.; Scheller T.

Courtois, B. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Design, Test, and Microfabrication of MEMS and MOEMS. Pt.2 : 30 March - 1 April 1999, Paris, France
Bellingham, Wash.: SPIE, 1999 (SPIE Proceedings Series 3680,2)
ISBN: 0-8194-3154-0
pp.687-695
Symposium on Design, Text, and Microfabrication of MEMS and MOEMS <1999, Paris>
Conference on CAD, Design and Test <1999, Paris>
Conference on Micromachining and Microfabrication <1999, Paris>
English
Conference Paper
Fraunhofer IOF ()
adhesive bonding; conventional micromachining; handling systems; micro optics; microassembly

Abstract
There is a growing demand for improvements in microassembly technology, especially in the area of high precision positioning. By observing the specific requirements of the micro world a spectrum of possibilities for the passive positioning supported by devices produced by conventional micromachining have been developed. By the experimental examination of different optical subassemblies an evaluation of the potentials of utilisation of the passive positioning was carried out.

: http://publica.fraunhofer.de/documents/PX-8655.html