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  4. Conformal copper deposition in deep trenches
 
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1997
Journal Article
Title

Conformal copper deposition in deep trenches

Author(s)
Bollmann, D.
Merkel, R.
Klumpp, A.
Journal
Microelectronic engineering  
DOI
10.1016/S0167-9317(97)00100-7
Language
English
IFT  
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