Options
Title
Sputterverfahren und Vorrichtung zur Beschichtung und/oder Oberflaechenbehandlung von Substraten
Date Issued
2002
Author(s)
Matthee, T.
Jung, T.
Klages, C.
Thomas, M.
Patent No
2001-10129313
Abstract
Die Erfindung betrifft ein Sputterverfahren zur Beschichtung und Oberflaechenbehandlung von Substraten mittels einer strukturierten Elektrodenmaske, die mit Durchbrechungen versehen ist und auf dem Substrat angeordnet wird. Ebenso betrifft die Erfindung eine Vorrichtung zur Beschichtung und Oberflaechenbehandlung von Substraten.
DE 10129313 C UPAB: 20021209 NOVELTY - Sputtering process comprises: activating the substrate surface in the regions exposed by an electrode mask by igniting a plasma at a process pressure of 1-70 Pa; and coating the substrate in the exposed regions by igniting hollow cathode plasma discharges in the passages at a process pressure of 70-500 Pa. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a device for carrying out the sputtering process. Preferred Features: The process pressure in the first step is 1-50 Pa and the process pressure in the second step is 100-400 Pa. The coating is made from metal oxides or metals, e.g. copper and platinum. USE - Used for coating and/or surface treating substrates, e.g. circuit carriers. ADVANTAGE - The process is effective.
Language
de
Patenprio
DE 2001-10129313 A: 20010619