Device for the vacuum metallization of large mobile substrates comprises vacuum vessel, pump system, evaporator, unit for holding and for transporting the substrates, arc discharge plasma source and magnetic field unit.

Abstract
Die Erfindung betrifft eine Einrichtung zur plasmaaktivierten Bedampfung grossflaechiger bewegter Substrate, mindestens, enthaltend einen Vakuumrezipienten, ein Pumpsystem, einen Verdampfer, eine Vorrichtung zur Halterung und zum Transport der zu beschichtenden Substrate und mindestens eine Bogenentladungs-Plasmaquelle, wobei mindestens eine magnetfelderzeugende Einrichtung enthalten ist, die in der Bedampfungszone zwischen dem Verdampfer und dem Substrat ein Magnetfeld erzeugen kann, dessen Feldlinien annaehernd senkrecht zur Bewegungsrichtung und parallel zur Transportebene des Substrates ausgerichtet sind und mindestens eine Bogenentladungs-Plasmaquelle so angeordnet ist, dass die Achse der Bogenentladungs-Plasmaquelle annaehernd senkrecht zu den Feldlinien des Magnetfeldes ausgerichtet ist.

 

WO2002103077 A UPAB: 20030214 NOVELTY - Device for the vacuum metallization of large mobile substrates comprises a vacuum vessel; a pump system; an evaporator; a unit for holding and for transporting the substrates to be coated; an arc discharge plasma source; and a unit for producing a magnetic field in the evaporation zone between the evaporator and the substrate. DETAILED DESCRIPTION - The field lines of the magnetic field are approximately vertical to the moving direction and are directed parallel to the transporting plane of the substrate. The arc discharge plasma source is arranged so that the axis of the source is approximately vertical to the field lines of the magnetic field. Preferred Features: The arc discharge plasma source is arranged so that the axis of the source is approximately vertical to the field lines of the magnetic field. Mobile strips, plates or molded bodies are provided as the substrates. The evaporator extends vertically to the moving direction and parallel to the transporting plane of the substrate over the whole width of the substrate. USE - Used for coating substrates such as plates made from plastic, glass or metal and paper or textiles. ADVANTAGE - The device is simple and economical.