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Patent
Title

Chip-Bauelement und Verfahren zu dessen Herstellung

Other Title
Chip device and process for its production
Abstract
Known chip devices are produced by coating plastic substrates. The substrate material is brittle and has low thermal conductivity. The invention presents a continuous high-productivity process for the production of a chip device which can be highly stressed and assembled by machine. A substrate made of insulating material is doubled up and a web made of good thermally conductive material is placed between the two substrates. The function and contact layers are first applied structured in the vacuum and compared by electron or laser beam before doubling. The chip devices are coated depending on the application (resistor, capacitor, zero resistor), trimmed and contacted.
Inventor(s)
Goedicke, K.
Panzer, S.
Heisig, U.
Schmidt, H.
Jarzak, W.
Link to Espacenet
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=4202824A
Patent Number
1992-4202824
Publication Date
1995
Language
German
Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik FEP  
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