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Plattenfoermiger Verbundkoerper

Compound board material has a carrier of lignin with natural fiber reinforcement to be bonded to a decorative layer by heat and pressure.
 
: Naegele, H.; Elsner, P.; Pfitzer, J.; Eckl, W.; Eyerer, P.; Eisenreich, N.

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Frontpage ()

DE 1998-19852033 A: 19981111
DE 1998-19852033 A: 19981111
DE 19852033 A1: 20000518
C08L0097
German
Patent, Electronic Publication
Fraunhofer ICT ()

Abstract
Ein Verbundkoerper besteht aus einem im wesentlichen plattenfoermigen Traeger aus Lignin und wenigstens einer mit diesem verbundenen Dekorschicht aus einem natuerlichen Werkstoff. Ferner ist ein Verfahren zur Herstellung eines derartigen Verbundkoerpers beschrieben.

 

DE 19852033 A UPAB: 20000712 NOVELTY - The compound board has a board carrier body and an applied decorative layer, of natural materials. The carrier is generally of lignin. DETAILED DESCRIPTION - The carrier is of lignin with natural fibers such as hemp, cellulose, wood and the like, as reinforcement. The decorative layer is a wood veneer, nonwoven, braiding, woven, knitted material, or laid bands of fibers, using natural fiber materials. An INDEPENDENT CLAIM is included for a manufacturing process, where the decorative layer is pressed against a board carrier of lignin, to be bonded together by heat and pressure. Preferred Features: The lignin carrier is reinforced with natural fibers. The decorative layer is bonded to the carrier in a press at a pressure of 40-400 bar at a temperature of 120-180 deg. C. A number of different decorative layers can be overlaid or overlapped in the press, and bonded to the carrier together. A fiber layer can be placed over the decorative layer, and the decorative layer surface can be given a profiled structure. USE - The compound board material is for floor coverings, such as a parquet, or for cladding walls and ceilings. It can also be used for the visible sides of furniture, musical instruments, housings, interior furnishings and the furnishing materials for automobile interiors. ADVANTAGE - The material is inexpensive, has the appearance of wood, is free of adhesives and has no hazards for the environment. The compound board can be shaped by conventional heat molding techniques.

: http://publica.fraunhofer.de/documents/PX-63536.html