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1995
Conference Paper
Titel
Berührungsfreie Charakterisierung von Lack- und Klebeschichten mit Mikrothermographie
Titel Supplements
Postervortrag
Abstract
Some applications of thermal wave microscopy in the fields of bonding technology, thickness measurement of paint and adhesion testing of laquer coatings are reported. The distribution of the glue in the bonding interface during curing is investigated in a contact-free and nondestructive way.