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Thermal and mechanical characterization of electronic packages in extremely hihg frequency applications by means of finite element analysis

EUROTHERM Seminar No.45.

1995, 10 pp.
Thermal Management of Electronic Systems <1995, Leuven>
Conference Proceedings
Fraunhofer IZM ()
coupling; deformation measurement technique; electronic packaging; FEM; mechanical analysis; mesh refinement; nonlinear material representation; thermal analysis; thermal stress; thermal test cycle