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  4. Thermal and mechanical characterization of electronic packages in extremely hihg frequency applications by means of finite element analysis
 
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1995
Conference Proceeding
Title

Thermal and mechanical characterization of electronic packages in extremely hihg frequency applications by means of finite element analysis

Title Supplement
EUROTHERM Seminar No.45.
Conference
Thermal Management of Electronic Systems 1995  
Language
English
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM  
Keyword(s)
  • coupling

  • deformation measurement technique

  • electronic packaging

  • FEM

  • mechanical analysis

  • mesh refinement

  • nonlinear material representation

  • thermal analysis

  • thermal stress

  • thermal test cycle

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