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1998
Conference Paper
Title
Avoiding cross talk and feed back effects in packaging coplanar millimeter-wave circuits
Other Title
Unterdrückung des Übersprechens und Rückkopplungseffekte beim Einbau von koplanaren Millimeterschaltungen
Abstract
The impact of the packaging configuration on cross talk and feed back effects caused by parasitic substrate modes is investigated for coplanar millimeter-wave circuits. It is demonstrated theoretically and by means of several circuit examples that both the mounting configuration and the thickness of the semiconductor substrate of coplanar MMICs have to be chosen appropriately, in order to avoid circuit degradation or even failure.
Conference