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X-ray inspection of solder joints by planar tomography (PCT)

: Neubauer, C.; Schröpfer, S.; Hanke, R.F.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Microwave Theory and Techniques Society:
IEMT-16. International Electronics Manufacturing Technology Symposium 1994. Proceedings
Piscataway, NJ: IEEE, 1994
ISBN: 0-7803-2037-9
International Electronics Manufacturing Technology Symposium (IEMT) <16, 1994, La Jolla>
Conference Paper
Fraunhofer IIS A ( IIS) ()
non-destructive testing; planar computer tomography; planare Computertomographie; Röntgenbildverarbeitung; Röntgeninspektion; Röntgenprüfung; x-ray image processing; x-ray inspection; zerstörungsfreie Prüfung

A new algorithm for 3D-reconstruction of objects from x-ray projections, called Planar Computer Tomography (PCT), is applied to inspection of solder joints. In contrast to axial computer tomography reconstruction is based on linear object movements instead of axial rotation. By this the handling of the Printed Circuit Board is simplified and integration into the conventional x-ray inspection process is enabled. Since the algorithm is well suited for parallels computers and only a few projections are necessary, a significant speed up will be achieved compared with axial Computer Tomography (CT) and other 3D inspection techniques.