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Title
Vorrichtung zur Oberflaechenbearbeitung wenigstens eines flaechig ausgebildeten Substrates
Date Issued
2001
Author(s)
Janes, J.
Huth, C.
Pilz, W.
Patent No
1996-19639637
Abstract
Equipment for the surface treatment of at least one flat substrate (3) coated on one side with an electrically non-conducting layer (3a), the other side being the surface to be processed, with a flat substrate electrode (1) of a plasma reactor upon which the substrate (3) is placed on its non-conducting side (3a), and a non-conducting electrode cover (2) fully covering the electrode surface against the plasma forming between the electrodes and having at least one opening for the substrate (3), which is fully surrounded by the cover (2) with the surface to be processed exposed to the plasma. The invention proposes an electrode cover (2) with through-holes (5) to make possible a charge carrier transport between plasma and substrate electrode surface. USE - For dry etching processes on substrates or wafers. ADVANTAGE - Provides effective process control parameter by measurement of DC-bias potential.
Language
de
Patenprio
DE 1996-19639637 A: 19960926