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Title
Vorrichtung zum Kuehlen von elektronischen Bauelementen
Date Issued
2001
Author(s)
Ebert, T.
Niehoff, J.
Patent No
1997-19710716
Abstract
The heat-sink has a number of individual layers, at least one microchannel plate (8) with a series of microchannels and a distribution channel, at least one intermediate plate (3-7) with a number of connecting channels and a collector plate (2) with a number of collector channels, assembled with the individual layers between a base plate (1) and a cover plate (13), to provide sealed cooling channels. A cooling medium for feeding through the latter channels is supplied to the heat sink via an inlet and discharged via an outlet, the intermediate plate forming a graded and/or skewed transitional structure between the inlet and outlet openings. ADVANTAGE - Increased cooling medium flow for efficient dissipation of waste heat.
Language
de
Institute
Patenprio
DE 1997-19710716 A: 19970314