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Vorrichtung und Verfahren zum Aufbringen einer Mehrzahl von Lotkugeln auf ein Substrat

Apparatus for placing several solder balls onto a substrate - in which solder balls picked up and held in position as a result of reduced pressure in the chamber above the holding element with channels.
 
: Azdasht, G.; Azadeh, R.; Ruethnick, C.; Lange, M.

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Frontpage ()

DE 1997-19715219 A1: 19970411
DE 1997-19739481 A: 19970909
DE 19739481 C2: 20010222
H05K0003
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
The apparatus for placing several solder balls onto a substrate incorporates a solder ball holding element (10) which channels (12) whose diameter is smaller than the diameter of the solder balls to be held. It further incorporates optical fibres (22) and an element (16) for holding them. This element is positioned so that the fibres are oriented in the direction of the respective channels in the ball holding element. The chamber (18) formed between the elements (10) and (16) can be put under a reduced pressure. The method consists of picking up and holding of solder balls as a result of reduced pressure in the chamber (18), positioning and release of them on a substrate, and melting of them by means of laser pulses through the channels (12). ADVANTAGE - Less time is required for such operations. Need for flux is obviated.

: http://publica.fraunhofer.de/documents/PX-40574.html