: Kluge, A.; Grimme, R.

Abstract
A set of different processes using wet chemistry are necessary for a microfabrication line. Cleaning, coating, developing, etching, coating removal, lift-off. In semiconductor fabrication lines these processes are performed in spin coaters, cleaners, etch tools, and others. To fulfil the requirements of homogeneity, cleanliness, low particulate emission, and high throughput, these tools are highly specialised and expensive. Otherwise, for manufacturing microsystem devices a strong demand for less expensive and flexible work stations is expected. Tools commerically available offer an integration of only a small number of steps in one machine. An important goal is to have a set of processes in one machine instead of two or more. This reduces the capital expenditures, the need for clean room area, the costs for installation, and danger of particulate contamination by handling from step to step. Furthermore, the number of SMIF stations and handlers is reduced. Designing new equipment by us ing modules seems to be necessary. Thereby, machines will be adopted to different applications by changing or omitting the modules relevant or unnecessary for the processes of interest. Customers' demands can be satisfied within a short time and machines already installed can easily be modified for a new application. The design of new equipment is presented. The essential parts are modules which can be interchanged. The advantages of the new design are described.