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Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte

Contactless chip-card manufacture method - using flip-chip technique to make connections between chip contacts and coil contacts on card surface.
: Aschenbrenner, R.; Ansorge, F.; Zakel, E.; Kasulke, P.

Frontpage ()

DE 1997-19732353 A: 19970728
DE 1997-19732353 A: 19970728
DE 19732353 A1: 19990204
Patent, Electronic Publication
Fraunhofer IZM ()

The method involves arranging an electrically conductive coil (2) on the surface of an insulating card (1). One or more non-packaged chips (4) are aligned in openings on the card surface. The electrical connections between the chip contacts and the coil contacts on the card surface are fabricated using flip-chip techniques. The card has openings may be made by injection moulding. The card body may be made of a thermoplastic material such as PVC, ABS or polycarbonate. USE - E.g. for telecommunication and identification, for insurance cards, patient data cards, emergency cards, credit cards or pay TV cards. ADVANTAGE - Provides good mechanical robustness and reliability.