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Verfahren zur Herstellung kontaktloser Chipkarten und kontaktlose Chipkarte

Contactless chip-card manufacture method - using flip-chip technique to make connections between chip contacts and coil contacts on card surface.
 
: Aschenbrenner, R.; Ansorge, F.; Zakel, E.; Kasulke, P.

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Frontpage ()

DE 1997-19732353 A: 19970728
DE 1997-19732353 A: 19970728
DE 19732353 A1: 19990204
G06K0019
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
The method involves arranging an electrically conductive coil (2) on the surface of an insulating card (1). One or more non-packaged chips (4) are aligned in openings on the card surface. The electrical connections between the chip contacts and the coil contacts on the card surface are fabricated using flip-chip techniques. The card has openings may be made by injection moulding. The card body may be made of a thermoplastic material such as PVC, ABS or polycarbonate. USE - E.g. for telecommunication and identification, for insurance cards, patient data cards, emergency cards, credit cards or pay TV cards. ADVANTAGE - Provides good mechanical robustness and reliability.

: http://publica.fraunhofer.de/documents/PX-39214.html