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Title
Verfahren zur Herstellung eines dreidimensionalen Bauteils oder einer Bauteilgruppe
Date Issued
1996
Author(s)
Rothe, M.
Maciossek, A.
Loechel, B.
Patent No
1994-4432725
Abstract
The invention relates to a process for the production of a three-dimensional component or a component group, in particular on surfaces of already processed semiconductor chips. The basis for known three-dimensional structures on chip surfaces is the structuring of thick photoresists followed by the galvanic shaping of said resist structures. Known processes only use thick photoresists and intermediate galvanic starting layers for forming the three-dimensional structures. The build-up of complex structures is only possible with increased effort due to the low stability of photoresists. The process according to the invention also uses the shaping of metal auxiliary layers (sacrificial layers) removed later in addition to the galvanic shaping of, for example, UV-structured photoresist layers with structural metal layers. Said metal auxiliary layers in the resist layers are also used for multilayer structures as galvanic starting layers for further build-up layers. The process described he re produces, for example, coils and transformers for integration on chip surfaces using three-dimensional structures which could previously not be realized in this form.
Language
de
Patenprio
DE 1994-4432725 A: 19940914