Verfahren zur Formung von Anschlusshoeckern auf elektrisch leitenden mikroelektronischen Verbindungselementen zum lothoecker-freien Tab-Bonden

The invention describes a process for the shaping of electrically conducting terminal bumps on electrically conducting microelectronic connecting elements. In conventional processes, a terminal bump is produced in a deep-draw process, whereby the connecting element is pressed by a die into a recess of a substrate on which the connecting element is fixed. The disadvantage is that a recess occurs next to the terminal bump on the side facing the die, said recess being deleterious for the mechanical loading capability and also for subsequent tab bonding. In the process according to the invention, however, a shaping tool is pressed onto part of the surface of a connecting element, whereby one or more terminal bumps are formed by the plastic deformation of the connecting element material in this part of the surface due to the geometry of the shaping tool, however, the connecting element suffers no further deformation outside said part of the surface. The advantages of the process according t o the invention are that no shaping substrate matched to the desired terminal bumps is required, that conventional wire bonding units can be used, that the process is fast, low-priced and precise and that the mechanical loading capability of a connecting element, in particular a metal lead, is .. due to the formation ..