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Verfahren zur Erzeugung von Lothuegeln auf einem Substrat

Solder bump production on substrate - by immersing cooled substrate in molten solder bath.
 
: Oppermann, H.H.

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Frontpage ()

DE 1996-19625139 A: 19960624
DE 1996-19625139 A: 19960624
DE 19625139 C2: 20010308
B23K0001
B23K0001
German
Patent, Electronic Publication
Fraunhofer IZM ()

Abstract
In a method of producing solder bumps on a substrate by contact with a molten solder bath, at least part of the substrate is cooled during contact with (preferably immersion in) the solder bath. Preferably, the substrate is a chip or wafer and is briefly dipped into the solder bath or wetted by a solder wave. ADVANTAGE - The method has lower equipment and material costs than prior art deposition methods, employs short and simple process steps and provides a copious solder supply for forming solder bumps of satisfactory height on the substrate.

: http://publica.fraunhofer.de/documents/PX-39118.html