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  4. Verfahren zur Aufbereitung der Schnittflaechen eines Bauteils fuer schichtweise arbeitende Fertigungsprozesse
 
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Patent
Title

Verfahren zur Aufbereitung der Schnittflaechen eines Bauteils fuer schichtweise arbeitende Fertigungsprozesse

Other Title
Component sectional surface preparation method for layered manufacturing technique - dividing component into segments using adaptive slicing technique employing 3-dimensional model of required component geometry.
Abstract
The component surface preparation method has the individual layers of the component divided into segments, with the local layer thickness for each of these segments determined, in dependence on the layer geometry. The component may be divided into segments via an adaptive slicing technique, using a 3- dimensional model of the required component geometry. The layer thickness of each segment may be determined from the localised curvature at each layer and the accuracy requirement. USE - For layered manufacturing technique for solid freeform fabrication, e.g. for laminated object manufacture, with computer-aided design. ADVANTAGE - Reduced manufacturing time.
Inventor(s)
Krause, F.
Ulbrich, A.
Ciesla, M.
Wirtz, H.
Link to Espacenet
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=19727934A
Patent Number
1997-19727934
Publication Date
1999
Language
German
Fraunhofer-Institut für Produktionstechnologie IPT  
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