• English
  • Deutsch
  • Log In
    Password Login
    Research Outputs
    Fundings & Projects
    Researchers
    Institutes
    Statistics
Repository logo
Fraunhofer-Gesellschaft
  1. Home
  2. Fraunhofer-Gesellschaft
  3. Patente
  4. Verfahren zum selektiven Abtragen einer oder mehrerer Schichten
 
  • Details
Options
Patent
Title

Verfahren zum selektiven Abtragen einer oder mehrerer Schichten

Other Title
Method for selective removal of one or more layers - with a the laser wavelength chosen dependent on the absorption characteristics of the material to be removed or preserved.
Abstract
The method concerns selective removal of one or several layers (3) from a substrate (1) or a layer which is to be left intact, using a laser (5), with self-regulating process limitation. Removal takes place during short interaction periods by means of a laser light with a wavelength such that its radiation is absorbed, by a layer (or layers) to be removed or to be preserved, to such an extent that its remaining energy no longer exceeds a threshold above which further material removal is possible. ADVANTAGE - Removal of layers without damaging the underlying surface is possible. Removal rates are increased, with improved removal selectivity.
Inventor(s)
Wiedemann, G.
Panzner, M.
Hauptmann, J.
Link to Espacenet
http://worldwide.espacenet.com/publicationDetails/biblio?DB=worldwide.espacenet.com&locale=en_EP&FT=D&CC=DE&NR=19715702A
Patent Number
1997-19715702
Publication Date
1998
Language
German
Fraunhofer-Institut für Werkstoff- und Strahltechnik IWS  
  • Cookie settings
  • Imprint
  • Privacy policy
  • Api
  • Contact
© 2024