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Title
Verfahren zum Kontaktieren eines elektronischen Bauelements mit Aluminium-Anschlussflaechen auf einem Substrat und damit hergestellte elektronische Schaltung
Date Issued
1996
Author(s)
Eldring, J.
Patent No
1994-4434104
Abstract
The invention relates to a process for bonding an electronic component, which has several aluminium terminal areas on its surface, to a substrate having a large number of pads, by means of contact metallizations formed between the aluminium terminal areas and the pads, whereby the contact metallizations consist of the connecting material gold, at least to a large extent. The pads on the substrate are therefore provided with bumps which consist to a large extent of gold (e.g. gold ball bumps), and furthermore, several aluminium terminal areas of the electronic component are aligned with the pads provided with bumps on the substrate and furthermore, under the exclusive effect of pressure and temperature, i.e. in particular without the application of ultrasound, a connection is made between the aluminium terminal areas and the bumps consisting to a large extent of gold on the substrate pads. The invention is therefore ideally suited for the flip chip assembly of non-bumped anorganic subst rates (e.g. ceramics) and organic substrates (e.g. FR-4 PCB).
Language
de
Patenprio
DE 1994-4434104 A1: 19940923