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Title
Verfahren zum Herstellen eines Mikromembranpumpenkoerpers
Date Issued
1998
Author(s)
Linnemann, R.
Richter, M.
Kluge, S.
Woias, P.
Patent No
1997-19719861
Abstract
The method is used to manufacture a pump body with an inlet opening having an inlet valve (106) and an outlet opening having an outlet valve (108). The method involves structuring a first main surface of each of a first and second semiconductor disc (200). The structuring defines a valve leaflet structure (202) of the inlet valve and a valve seat structure (204) of the outlet valve in the first disc. It also defines a valve leaflet structure of the outlet valve and a valve seat structure of the inlet valve in the second disk. A valve leaflet recess structure and a valve opening recess structure are formed in predetermined relationship to the valve leaflet and valve seat structures in a second main surface of each of the disks. The first surfaces of the first and second disks are connected such that each valve leaflet structure has a predetermined relationship to a respective valve seat structure. The second surfaces of each disk are etched at least in the region of the valve leaflet re cess structure and the valve opening recess structure to free the valve leaflets and to open the valve seats. ADVANTAGE - Provides simple method of manufacturing thin pump bodies in semiconductor wafers. Has higher compression ratio.
Language
de
Patenprio
DE 1997-19719861 A: 19970512