Method for moulding powder and bonding agent mixtures - with the temperature of the moulding device during moulding kept above the melting point of the powder and bonding agent mixture.

: Geiger, M.; Koch, K.U.

Abstract
The method concerns moulding of powder and bonding agent mixtures (105) with use of a moulding device (101, 102) which is produced by a rapid prototyping process and consists of one or more parts. It is characterised by the fact that the temperature of the moulding device (101, 102) during the moulding process is above the melting temperature of the powder and bonding agent (105). USE - Primarily for prototype and small batch production. ADVANTAGE - Both mouldings and moulding devices can be produced in a cost-effective manner.